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Hot air solder leveling : ウィキペディア英語版 | Hot air solder leveling
HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. == Advantages of HASL ==
* Excellent wetting during component soldering *Avoids copper corrosion.
抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)』 ■ウィキペディアで「Hot air solder leveling」の詳細全文を読む
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